TDK's soft-termination CNA series utilizes a design concept which reduces the amount of soft resin material. The conductive resin electrode layer is only applied at the soldering positions to absorb mechanical stress caused by board flex. Lower parasitic resistance and inductance are realized due to the reduction of soft resin material from the conventional series.

The low-resistance, soft-termination MLCC provides identical mechanical performance to the conventional soft-termination series. Typical applications are where significant board flex may occur, including safety/critical automotive applications such as powertrain, suspension, airbag, and battery line applications. Since the soft-termination feature is a termination technology, TDK can theoretically extend this design technique to its existing capacitance range, allowing for a wide capacitance offering.