EPC’s 30 V eGaN half-bridge, EPC2111, integrates two eGaN power FETs into a single device increasing both efficiency and power density while reducing assembly costs to the end user’s power conversion systems. The EPC2111 comes in a chip-scale package for improved switching speed and thermal performance and is only 3.5 mm x 1.5 mm for increased power density. A primary application for this device is for notebook and tablet computing. The high-frequency capability of GaN reduces the size required for power conversion and thus will drive significant size reductions of next-generation mobile computing.