Würth Elektronik's WE-SMGS series surface mount solderable gaskets are the perfect alternatives to the WE-SECF contact finger series. If the contact fingers cannot reach the desired mechanical dimensions, the WE-SMGS series is the better solution. The WE-SMGS series can be used by a pick and place machine and reflow soldered. To keep the best performance, it is recommended to solder the gaskets during the last PCB reflow process. The gaskets are designed with a thermal resistant foam which causes high elasticity, allowing it to be compressed and then recovered to its original shape after being compressed. At the same time, it provides the gasket characteristic of being able to be placed in high environmental temperatures. The layer which surrounds the thermal resistant foam is made of copper with a tin plating which allows an easier soldering process.